CL31C010BBCANNC

The CL31C010BBCANNC is a multilayer ceramic capacitor (MLCC) manufactured by Samsung. This component belongs to Samsung's CL series of capacitors, which are widely used in consumer electronics, industrial equipment, and telecommunications applications. MLLCs are fundamental passive components found in virtually every modern electronic device, serving critical functions in power supply circuits, signal filtering, decoupling, and high-frequency applications. As a ceramic capacitor, this part utilizes a ceramic dielectric material sandwiched between multiple layers of conductive electrodes, all assembled in a compact surface-mount package. The part number designation indicates this is a standard performance component suitable for general-purpose applications where reliability and cost-effectiveness are balanced priorities. Samsung's CL series capacitors are recognized for consistent quality and stable electrical performance across temperature and frequency ranges typical of industrial and commercial environments. This component is typically employed in power distribution networks where it provides local energy storage and voltage stabilization near integrated circuits and voltage regulators. Engineers commonly specify MLLCs from Samsung's CL series in audio equipment, switching power supplies, LED drivers, and various digital control circuits. The multilayer construction allows these capacitors to offer reasonable capacitance values in very small physical packages, making them ideal for space-constrained designs where board area is at a premium. The CL31C010BBCANNC would be selected over alternative capacitors when an engineer requires a dependable, mid-range ceramic capacitor with proven field performance. Samsung's manufacturing reputation and quality standards make the CL series a preferred choice for OEM designers who prioritize supply chain reliability and consistent part behavior across production batches. These capacitors are also well-suited for applications requiring high-volume production, where standardized component sourcing reduces engineering complexity and procurement overhead. The surface-mount package format ensures compatibility with modern automated assembly processes and automated optical inspection (AOI) systems used in contemporary manufacturing environments. This packaging style also supports high-density PCB layouts and facilitates wave soldering and reflow soldering operations standard in electronics manufacturing. For engineers evaluating this part, the primary consideration typically centers on whether the capacitance value, voltage rating, and physical dimensions align with specific circuit requirements. The CL series represents a mainstream choice for non-critical filtering and coupling applications where performance stability matters more than specialized characteristics, making it a sensible default selection for many general-purpose electronic designs.