MLPF-WB55-01E3

Available on request— submit an RFQ for pricing and lead time

MLPF-WB55-01E3 is sourceable through our global supplier network. Submit an RFQ for price and lead time.

Previously available
ManufacturerQtyPrice / pcsLead timeDate code
STMicroelectronics2,500 Clients only3d23+
STMicroelectronics250 Clients only3d23+
STMicroelectronics2,500 Clients only3d22+
STMicroelectronics250 Clients only3d22+
STMicroelectronics5,000 Clients only2w23+
STMicroelectronics250 Clients only2w20+
ST2,500 Clients only2w22+
ST250 Clients only2w22+
STMicroelectronics2,500 Clients only2w23+
STMicroelectronics2,500 Clients only2w21+
STMicroelectronics250 Clients only2w22+
STMicroelectronics2,240 Clients only2w22+
STMicroelectronics250 Clients only2w22+
# MLPF-WB55-01E3 Product Description The MLPF-WB55-01E3 is a broadband low-pass filter component designed for RF and microwave signal conditioning applications. This component belongs to the MLPF series family, which serves engineers working with high-frequency signal integrity and EMI/RFI suppression across industrial, telecommunications, and aerospace sectors. Low-pass filters like this unit are essential building blocks in RF circuits where controlling bandwidth and attenuating unwanted high-frequency signals is critical to system performance. They are commonly integrated into receiver front-ends, transmitter output stages, and intermediate frequency (IF) signal paths. The MLPF-WB55 designation indicates this is a surface-mount component optimized for integration into modern PCB designs where space efficiency and automated assembly are priorities. Applications for broadband low-pass filters of this type include satellite communications equipment, radar systems, wireless infrastructure, test and measurement instrumentation, and defense electronics. Engineers specify these filters when they need to reject out-of-band noise and interference while maintaining flat passband response across their operating frequency range. The "01E3" suffix typically indicates a specific performance variant within the MLPF-WB55 family, suggesting particular cutoff frequency, insertion loss, or impedance characteristics suited to a defined application segment. The surface-mount package format allows for compact PCB layouts and high-density component placement, reducing overall system size while maintaining electrical performance. This packaging approach also facilitates automated manufacturing processes and simplified rework procedures compared to larger connector-based filter modules. Engineers choose the MLPF-WB55-01E3 over alternative solutions when they require a balance of compact form factor, broadband performance characteristics, and cost-effective integration into production designs. Unlike larger cavity or waveguide filters, this component offers flexibility in circuit topology while maintaining the frequency selectivity needed for signal chain management. Compared to passive component implementations using discrete inductors and capacitors, an integrated filter module provides more predictable performance, tighter tolerances, and faster design-to-production cycles. This component is suitable for both new equipment designs and replacement applications in field-proven systems. Its reliability in demanding RF environments, combined with the standardized MLPF family pinout and performance specifications, makes it a practical choice for design engineers seeking validated, interchangeable solutions for broadband filtering requirements.

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